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4
PACKAGE DIMENSIONS
SOT?23 (TO?236)
CASE 318?08
ISSUE AP
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
SCALE 10:1
mm
inches
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
VIEW C
L
0.25
L1
e
E
HE
b
A
SEE VIEW C
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1
0.01 0.06 0.10 0.001
b
0.37 0.44 0.50 0.015
c
0.09 0.13 0.18 0.003
D
2.80 2.90 3.04 0.110
E
1.20 1.30 1.40 0.047
e
1.78 1.90 2.04 0.070
L
0.10 0.20 0.30 0.004
0.040 0.044
0.002 0.004
0.018 0.020
0.005 0.007
0.114 0.120
0.051 0.055
0.075 0.081
0.008 0.012
NOM MAX
L1
2.10 2.40 2.64 0.083
0.094 0.104
HE
0.35 0.54 0.69 0.014 0.021 0.029
c
0?
???
10 0?
?
???
10?
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